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PCB Prototype - BGA

PCB Prototype - 8 Layer, Immersion Gold 3u" Finish Board

Manufacturer - D-Ying Electronic, Inc.
Model # - PCB Prototype 8 Layer, Immersion Gold 3u" Finish
SKU - BGA PCB Prototype
Submitted By - D-Ying Electronic Inc. (Manufacturer, Service Provider)
Country - Taiwan
Category - Computers : Hardware : Motherboards

Contact   |   Link To Product   |   More Products By This Company

Images

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8layer-immersion-gold-3u-finish-board

Specifications

BGA :   Smallest hole 0.2mm.

Details

BGA

A BGA is a surface-mount package used for ICs. Solder balls are stuck to the bottom of the package, and the BGA is placed on a PCB that maintains copper pads in a pattern that matches the solder balls. The assembly is then heated in a reflow oven, causing the solder to melt, flow around the BGA footprint and align with the PCB.

PCB Prototype - 8 Layer, Immersion Gold 3u" Finish Board

- BGA.

Advantages:
Our BGA capability :
- Smallest hole 0.2mm.
- Smallest ball 8mil~10mil.
- Pad over Via with epoxy. (epoxy will provide a smoother BGA surface.)

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